QWIN – Solder Paste

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Solder paste is an important bonding material in the
surface mounting process of circuit board. Suitable
solder paste needs to consider the alloy content, alloy
composition, powder particle size and flx type and so
on. We supply various kinds of tin paste. Products are
widely used in screen printing and automatic dispensing
process.

 

 

Specification :

Type Specification Alloy Melting Point ℃ Particle Size um Flux Content %
 Lead B-SP63 Sn63Pb37 183 2-150 10-12
B-SPA362 Sn63Pb36Ag2 179-180 2-151 10-13
Lead-Free B-SAC305 Sn96.5Ag3.0Cu0.5 217-219 2-152 10-14
B-SA35 Sn96.5Ag3.5 221 2-153 10-15
Low Temperature B-SB42 Sn42Bi58 139-141 2-154 10-16